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Fan Ren
Charles A. Stokes Professor
| Email: |
ren@che.ufl.edu |
| Phone: |
(352)
392-4727 |
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317 Chemical Engineering Building |
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Wide Energy Bandgap Electronic Devices
Wide energy-bandgap electronic devices, typically based on GaN films, have
been extensively investigated in recently years due to their unique optical and
electronic properties and exciting potential applications. In particular,
visible and ultraviolet lasers and light-emitting diodes for have been
demonstrated for display and data-storage applications. This effort is part of
a consortium chartered with developing the requisite technologies for high power
and high breakdown voltage electronics based on GaN materials. Contact
metallization, passivation, device integration, and characterization studies are
routinely performed using state-of-the-art equipment. This work has been
supported by the Office of Naval Research, the Electric Power Research
Institute, and the Defense Advanced Research Projects Agency.
Semiconductor Device Passivation
This research program aims to develop the basic science and technology of
low-temperature deposition methods that can provide reliable and reproducible
passivation for compound semiconductor devices, such as pseudomorphic AlGaAs/InGaAs/GaAs
PHEMTs, GaAs MESFETs, GaAs based HBTs and InGaAs/InP based HBTs, and GaN based
devices. There are three major topics under investigation:
- Deposition of silicon-nitride based dielectrics using different
precursors such as SiH4/NH3, SiH4/N2,
SiD4/ N2,
SiD4/ND3,
and hydrogen-free dielectric, and incorporation of a D, O, or N plasma
treatment into to reduce the occurrence of dangling bonds.
- Optimization of the dielectric material quality with different
deposition techniques and conditions. The systems considered include
conventional plasma enhanced chemical vapor deposition (PECVD), down-stream
electron cyclotron resonance chemical vapor deposition (ECRCVD), and
inductively coupled plasma chemical vapor deposition (ICPCVD).
- Characterization of device degradation mechanisms related to deposition
techniques, dielectric film quality, and the hydrogen passivation effect.
Selected Patents
- “GaN-type enhancement MOSFET using heterostructure”,
Abernathy, Irokawa, Pearton, Ren, US 6,914,273 (2005).
- "Air Isolated Crossovers",
Kossives, Tai, Ren, US 6,683,384(2004).
- "Method of Making An Article Comprising An Oxide Layer on A GaAs-Based Semiconductor Body",
Chen, Cho, Hong, Hobson, Kuo, Kwo, Murphy, Ren, US 6,271,0698(2001).
- "Method of Forming A T-Shape Gate",
Lothian, Ren, Weiner, US 5,981,319(1999).
- "Article Comprising An Oxide Layer on GaN",
Hong, Hobson, Lothian, Mannaerts, Ren, US 5,912,498(1999).
- "GaAs Based MOSFET, And Method of Making Same",
Cho, Hong, Hobson, Mannaerts, Ren, US 5,903,037(1999).
- "Method of making an article comprising an oxide layer on a GaAs-based semiconductor body",,
Hong, Hobson, Lothian, Mannaerts, Ren, European 993055128(1999).
- "Method of making an article comprising an oxide layer on a GaAs-based semiconductor body",
Hong, Hobson, Lothian, Mannaerts, Ren, European 993055128(1999)
- "Improved Air Isolation Crossovers",
Kossives, Tai, Ren, European 98307916(1998).
- "Article Comprising An Oxide Layer on GaN and Method of Making the Article",
Hobson, Hong, Lothian, Mannaerts, Ren, European, 98307928(1998).
Selected Publications
- “Comparison of MOS and Schottky W/Pt-GaN Diodes for Hydrogen
Detection", B.S.Kamg, S.Kim, F.Ren, B.P.Gila, C.R.Abernathy and
S.J.Pearton, Sensors and Actuators, Vol. B105, 232-236 (2005).
- “Detection of CO Using Bulk ZnO Schottky Rectifiers",
B.S. Kang, F. Ren, K. Ip, Y. W. Heo, B.P.Gila, C. R.Abernathy,
D.P.Norton and S.J.Pearton, Appl. Phys. Vol. A, 259-2616 (2005)
- “Thermal Degradation of Electrical Properties And Morphology
of Bulk Single-Crystal ZnO Surfaces", R. Khanna, K. Ip, Y.E. Heo,
D.P. Norton, S.J.Pearton and F.Ren, Appl. Phys. Lett.. Vol. 85,
3468-3470(2004).
- “Electrical Transport Properties of Single ZnO Nano-Rods",
Y.W. Heo, L.C.Tien, D.P.Norton, B.S.Kang, F.Ren B. Gila, and S.J.Pearton,
Appl. Phys. Lett. Vol. 85, 2002-2004 (2004).
- “Effect of Deposition Conditions and Annealing on W Schottky
Contacts on n-GaN", R. Mehandru, S. Kang, S.Kim, F. Ren, I.
Kravchenko, W.Lewis, and S.J.Pearton, Materials Sci. in Semicond.
Processing, Vol. 7, 95-98 (2004).
- “Enhanced Functionality in GaN and SiC Devices By Using Novel
Processing", S.J.Pearton, C.R.Abernathy, B.P.Gila,
F.Ren,J.M.Zavada and Y.D.Park, Appl. Phys. Lett., Vol. 48,
1965-19746 (2004).
- “Lateral Schottky GaN Rectifiers Formed By Si+ Ion
Implantation", Y. Irokawa, J. Kim, F. Ren, K.H. Baik, B.P. Gila,
C. R. Abernathy, S.J.Pearton, C.C.Pan, G.T.Chen and J.I. Chyi, J.
Electronic Materials, Vol. 33, 426-430 (2004).
- “SiC Via Holes by Laser Drilling", S. Kim, B.S.Kang,
F. Ren, J.,D’entremont, E.Blumenfeld, T. cordock and S.J.Pearton, J.
Electronic Materials, Vol. 33, 477-480 (2004).
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